Certificate Programs and Courses
The Next Generation Microelectronics Research Center (NGeM) is focused on providing students with a deep understanding of the microelectronic chip development processes.
The University of Idaho College of Engineering is expanding its microelectronics courses, training and certificate programs.
Semiconductor & Microelectronics Courses
Microelectronics I
Course No.: ECE 310
Operational amplifier fundamentals and applications, introduction to electronic devices such as diodes, bipolar junction transistor (BJT) and metal oxide semiconductor field effect transistors (MOSFET).
Microelectronics II
Course No.: ECE 410
This course is an introduction to analog integrated circuit (IC) implementation and design, differential and common-mode signal concepts, differential amplifiers, multistage amplifiers, operational amplifier design, frequency response of electronic circuits.
Analog Integrated Circuit Design
Course No.: ECE 415/515
This course serves as an introduction to electronic packaging and "back-end" microelectronic processes. Topics include substrate design & fabrication, SMT & first level assembly, clean room protocol, thermal design, simulation, and process considerations.
Introduction to Electronic Packaging
Course No.: ECE 418/518
This course serves as an introduction to electronic packaging and “back-end” microelectronic processes. Topics include substrate design and fabrication, SMT and first level assembly, clean room protocol, thermal design, simulation and process considerations.
Semiconductor Devices
Course No.: ECE 460
This course covers crystal structure, quantum mechanics, energy band and statistical mechanics of semiconductor devices; carrier transportation, PN junction and heterojunctions structure and Mosfet structure; electro optics.
Quantum Mechanics for Electrical Engineers
Course No.: ECE 462/562
This course teaches fundamental theory and behavior of modern semiconductor devices.
Introduction to Microelectronics Fabrication
Course No.: ECE 465/565
This course serves as an introduction to the fabrication of microelectronic devices. Topics include the basics of IC structures, clean room protocol, photolithography, film growth and deposition, as well as IC interconnect technologies.